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A Comparison of PTFE and PFA Fluoropolymers as Wetted Parts in Advanced Semiconductor Manufacturing
June 12th, 2019
In this Silicon Semiconductor article, industry experts examine two types of fluoropolymers used to construct semiconductor process chemical containment vessels and concluded that the type of polymer utilized can affect the potential for particle contamination.
Semiconductor manufacturing incorporates a number of wet process steps in the construction of a microchip. In these steps, the cleaning or etching fluid used is often heated to improve its efficiency. Various fluid heaters have been developed for use in semiconductor manufacturing, and these heaters are often constructed using fluoropolymers for the wetted parts (i.e., the portion of the heater actually coming into contact with the fluid to be heated). Two particular types of fluoropolymers are typically used in these applications: Polytetrafluorethylene (PTFE) and Perfluoroalkoxy (PFA).
PTFE is found extensively in wetted parts in pumps and valves, and in other applications where the number of parts required are too small to justify the tooling costs required in manufacturing PFA wetted parts. And while both PTFE and PFA are high purity materials, have exceptional resistance to corrosive chemicals and harsh environments, and are excellent barrier materials due to their low diffusion coefficient, one of these two materials appears to be less susceptible to particle contamination, and hence is more suitable for use in wetted parts.
Read the entire article, which was co-written by Saint-Gobain Engineer and Global Marketing Manager Stephane Domy and Heateflex Corporation President and CEO Jorge Ramirez.