A couple of years ago, chips were most likely manufactured to be used for a very specific and narrow type of application associated to the image of a computer; today the breadth of their application is so wide that they are present in almost any device that you may use on a daily basis from your phone, car, health monitoring device, IoT (Internet of Things), etc. This move has been enabled through dye shrinking and optimizing yield performance on any given process ensuring the safest work environment for the manufacturing team.
As of today dye shrinking has been mostly associated with the lithography process, since they are so closely related. But because dye shrinking involves smaller print, every element, even the smallest ones become critical, thus we deal with more severe requirements in material cleanliness and purity.
Using the SEMI standard as a requirement for the cleanliness and purity of our components, we are closely working with the industry experts to adjust our threshold to their unique requirements, using our expertise on material science and processing, environment of production and traceability in our entire supply chain.
Optimizing yield performance requires development only made possible through intimacy with the customer process and matching requirements through existing components or development of a unique custom solution. This expertise varies based on the application; in the facility, when working on the hook up, expertise in fluid mechanics to ensure proper flow and pressure is needed. On the sub fab chemical distribution system (CDS; CCSS; SDS; BCDS) expertise in fluid mechanics, chemical compatibility (instant and over the time), mechanical and pneumatic compatibility (for the pump) is needed. In processes closer to the wafer, the focus is on how reliable and how durable the component is, and also how this is impacting the product carried. For Chemical Mechanical Polishing (CMP) valve actuation and it impact on the integrity of the slurry is important as this will allow the system to have a more stable removal rate across a longer period of time. For the etching process, the chemical dosing precision over time is critical to ensure that the chemistry used on the wafer will have the right composition and as a result the right action. For cleaning, focusing on dispensing the exact quantity of liquid on the wafer is necessary to remove every targeted chemistry.
At Saint Gobain, we understand the intricacies of the fluid transfer application in the semiconductor industry, thus we are a long term solution supplier, with comprehensive design capability, material science know how, application expertise that offer peace of mind. We provide the best support to OEMs by designing or co-developing components or subsystems that will enable them to build the most reliable chemical distribution system or wafer processing equipment and achieving optimum yield for their unique application.